CN-8760G Thermally Conductive Potting Compound for Electrical and Electronic Applications

Dow CorningCN8760 potting compound is a two-component thermally conductive adhesive, mixed in a 1:1 ratio, dark gray in color, with a mixed viscosity of 2850 cps. Dow Corning CN8760 potting compound offers excellent thermal conductivity and reworkability, suitable for materials such as PC, ABS, PVC, and metal panels. It can cure at room temperature or be heat-cured. CN8760 potting compound does not produce any by-products during the curing process, and the adhesive's flame retardancy complies with UL 94 V0 standards. Dow Corning CN8760 potting compound is easy to mix and convenient to operate. The excellent fluidity of the adhesive accelerates processing and shortens cycle times. Its thermal conductivity reaches 0.67 W/mK, effectively helping LED products dissipate heat. Dow Corning CN8760 potting compound is non-corrosive to metals and compatible with most plastics, making it an ideal choice for LED potting and assembly processes. Dow Corning CN8760 potting compound is primarily used for potting LED power supplies and panels, protecting LED

products from damage caused by harsh conditions such as high temperatures, extreme weather, thermal cycling, mechanical shock, vibration, mold, and dirt. Dow Corning CN8760 potting compound provides stable dielectric insulation, serving as an effective barrier against environmental pollution, while also mitigating stress from impact and vibration across a wide range of temperatures and humidity levels. This thermally conductive LED potting compound offers excellent protection for precision and high-demand LED products.

Working time @25°C (pot life) 100 minutes

Heat curing @50°C 45 minutes

Tensile strength Psi 400

Elongation 95%

Hardness Shore A 49

Dielectric strength 26 kV/mm

Volume resistivity >1E16

Dielectric constant (100Hz) 3.868

Dissipation factor (100Hz) 0.0181

Thermal conductivity 0.65 W/mK

Linear thermal expansion coefficient 275 ppm/°C

Shelf life @25°C 12 months